Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject peel test
Showing results 1 to 7 of 7
| Analyses of the practical adhesion strengths of the metal/polymer interfaces in electronic packaging Yu, Jin; Song, JY; Park, IS, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.12, pp.1347 - 1352, 2002-12 |
| Analysis of the T-peel strength in a Cu/Cr/polyimide system Song, JY; Yu, Jin, ACTA MATERIALIA, v.50, no.16, pp.3985 - 3994, 2002-09 |
| Effects of electroplated Cu thickness and polyimide plasma treatment conditions on the interfacial fracture mechanics parameters in the Cu/Cr/polyimide system Park, Young Bae; Yu, Jin, METALS AND MATERIALS-KOREA, v.7, no.2, pp.123 - 131, 2001-04 |
| Interfacial fracture energy measurements in the Cu/Cr/polyimide system Park, YB; Park, IS; Yu, Jin, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.266, no.1-2, pp.261 - 266, 1999-06 |
| Ionized metal plasma(IMP) sputter system을 이용해 증착한 Cu/Ta(N) 박막의 접착특성 및 확산방지특성에 대한 연구 = Adhesion and diffusion barrier properties of Cu/Ta(N) films fabricated by IMP sputteringlink 김용철; Kim, Yong-Chul; et al, 한국과학기술원, 2007 |
| Phase angle in the Cu/polyimide/alumina system Park, YB; Yu, Jin, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.266, no.1-2, pp.109 - 114, 1999-06 |
| Study on the effects of copper oxide growth on the peel strength of copper/polyimide Lee, Hyuek Jae; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.8, pp.1102 - 1110, 2008-08 |
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