Analyses of the practical adhesion strengths of the metal/polymer interfaces in electronic packaging

Abstract

There is a plethora of techniques to measure the adhesion strength of metal/polymer interfaces. However, the practical adhesion strength, which is the work done in separating the film from the substrate (or one film from another), is very sensitive to the test methods and the mechanical effects, such as the residual stress, thickness and mechanical properties of the layers, strain rate, and phase angle. Deriving intrinsic-adhesion properties of the interfaces, which are independent of such parameters, from the practical adhesion-strength measurements is a formidable task. In the present work, data from the three commonly used adhesion tests; pull-out, 90degrees-peel, and T-peel tests are compared with the intrinsic-adhesion properties of the interface, such as the interface-fracture toughness or the interface-fracture energy, and their implications are discussed. Material systems analyzed were Cu-based lead frame/epoxy-molding compound (EMC) and Cu/Cr/polyimide.