Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject intermetallic compound
Showing results 1 to 13 of 13
| Cu/Al 간 금속간화합물 형성이 Cu 와이어와 Al 패드의 접착력에 미치는 영향 = Effects of Cu/Al intermetallic compound(IMC) formation on Cu wire and Al pad bondabilitylink 김형준; Kim, Hyoung-Joon; et al, 한국과학기술원, 2002 |
| Effect of Ag Addition on the Ripening Growth of Cu6Sn5 Grains at the Interface of Sn-xAg-0.5Cu/Cu During a Reflow Cho, Moon-Gi; Park, Yong-Sung; Seo, Sun-Kyoung; Paik, Kyung-Wook; Lee, Hyuck-Mo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.12, pp.1939 - 1946, 2011-12 |
| Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations Xia, YH; Jee, YK; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1858 - 1862, 2008-12 |
| Effects of Cu and Pd addition on au bonding wire/Al pad interfacial reactions and bond reliability Gam, SA; Kim, HJ; Cho, JS; Park, YJ; Kim,SH; Moon, JT; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.2048 - 2055, 2006-11 |
| Effects of pd addition on au stud bumps/Al pads interfacial reactions and bond reliability Kim, HJ; Cho, JS; Park, YJ; Lee, J; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.33, pp.1210 - 1218, 2004-10 |
| Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads Jee, Young-Kun; Ko, Yong-Ho; Sohn, Yoon-Chul; Yu, Jin, ELECTRONIC MATERIALS LETTERS, v.2, no.3, pp.161 - 166, 2006-12 |
| Electrochemical lithiation reactions of Cu6Sn5 and their reaction products Choi, W; Lee, JeongYong; Lim, HS, ELECTROCHEMISTRY COMMUNICATIONS, v.6, pp.816 - 820, 2004-08 |
| Morphological transition of interfacial Ni3Sn4 grains at the Sn-3.5Ag/Ni joint Kim, JH; Jeong, SW; Kim, HD; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.32, no.11, pp.1228 - 1234, 2003-11 |
| Prediction of primary intermetallic compound formation during interfacial reaction between Sn-based solder and Ni substrate Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.46, no.11, pp.777 - 781, 2002-06 |
| Sn-3.5Ag 솔더와 Zn 표면층의 반응을 통한 솔더 계면현상과 충격 신뢰성에 관한 연구 지영근; 유진, 마이크로전자 및 패키징학회지, v.15, no.4, pp.87 - 92, 2008-12 |
| Sn-Ag-Cu계 솔더 합금과 Cu, Ni 기판의 계면 현상 및 계면 생성물의 성장 거동에 관한 연구 = Studies on interfacial reaction and microstructural evolution of joint interface between Sn-Ag-Cu solder alloy and Cu, Ni substratelink 김종훈; Kim, Jong-Hoon; et al, 한국과학기술원, 2005 |
| The effect of microstructures on creep behavior of Ti-48Al-2W intermetallic compounds Kim, HY; Hong, Soon-Hyung, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.329 , no.SI, pp.788 - 794, 2002-06 |
| 액상 Au-Sn 솔더와 Ni 기판의 계면현상에 대한 고찰 김종훈; 정상원; 이혁모; 김성수, Journal of the Microelectronics and Packaging Society, v.11, no.3, pp.47 - 53, 2004-09 |
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