Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations

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Aluminum was added into Sn-3.0Ag (wt.%) solder to investigate the effect of aluminum concentration on the interfacial reaction of Sn-3.0Ag-xAl solders with copper or electroless nickel immersion gold (ENIG) metallizations. Four different Sn-3.0Ag-xAl solders (x = 0 wt.%, 0.1 wt.%, 0.5 wt.%, and 1.0 wt.%) were used for comparison. It was found that the composition, morphology, and thickness of interfacial reaction products were strongly dependent on aluminum concentration. At low aluminum concentration (0.1 wt.%), the typical Cu(6)Sn(5) layer was formed at the interface. When the aluminum concentration was 0.5 wt.%, a continuous CuAl(2) layer spalled off from the interfacial Cu-Sn intermetallic compound (IMC) layer. Only a planar CuAl(2) layer was observed at the interface when the aluminum concentration was increased to 1.0 wt.%. In Sn-Ag-Al/ENIG reactions, Ni(3)Sn(4) was formed and spallation occurred near the interface in the Sn-3.0Ag and Sn-3.0Ag-0.1Al solder joints. When the aluminum concentration was higher than 0.1 wt.%, a thin planar AuAl compound formed at the interface. There was no P-rich phase formation that retarded the spalling phenomenon. The aluminum additive in Sn-Ag solder inhibited the growth of IMCs in the reaction with copper or ENIG metallizations, which was favorable for the reliability of solder joints.
Publisher
SPRINGER
Issue Date
2008-12
Language
English
Article Type
Article
Keywords

LEAD-FREE SOLDERS; INTERMETALLIC COMPOUNDS; PHOSPHORUS-CONTENT; NI-P; JOINTS; SN; MICROSTRUCTURES; GROWTH; ALLOY; CU

Citation

JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1858 - 1862

ISSN
0361-5235
DOI
10.1007/s11664-008-0548-7
URI
http://hdl.handle.net/10203/92814
Appears in Collection
MS-Journal Papers(저널논문)
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