Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations

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dc.contributor.authorXia, YHko
dc.contributor.authorJee, YKko
dc.contributor.authorYu, Jinko
dc.contributor.authorLee, TYko
dc.date.accessioned2013-03-08T10:14:47Z-
dc.date.available2013-03-08T10:14:47Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2008-12-
dc.identifier.citationJOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1858 - 1862-
dc.identifier.issn0361-5235-
dc.identifier.urihttp://hdl.handle.net/10203/92814-
dc.description.abstractAluminum was added into Sn-3.0Ag (wt.%) solder to investigate the effect of aluminum concentration on the interfacial reaction of Sn-3.0Ag-xAl solders with copper or electroless nickel immersion gold (ENIG) metallizations. Four different Sn-3.0Ag-xAl solders (x = 0 wt.%, 0.1 wt.%, 0.5 wt.%, and 1.0 wt.%) were used for comparison. It was found that the composition, morphology, and thickness of interfacial reaction products were strongly dependent on aluminum concentration. At low aluminum concentration (0.1 wt.%), the typical Cu(6)Sn(5) layer was formed at the interface. When the aluminum concentration was 0.5 wt.%, a continuous CuAl(2) layer spalled off from the interfacial Cu-Sn intermetallic compound (IMC) layer. Only a planar CuAl(2) layer was observed at the interface when the aluminum concentration was increased to 1.0 wt.%. In Sn-Ag-Al/ENIG reactions, Ni(3)Sn(4) was formed and spallation occurred near the interface in the Sn-3.0Ag and Sn-3.0Ag-0.1Al solder joints. When the aluminum concentration was higher than 0.1 wt.%, a thin planar AuAl compound formed at the interface. There was no P-rich phase formation that retarded the spalling phenomenon. The aluminum additive in Sn-Ag solder inhibited the growth of IMCs in the reaction with copper or ENIG metallizations, which was favorable for the reliability of solder joints.-
dc.languageEnglish-
dc.publisherSPRINGER-
dc.subjectLEAD-FREE SOLDERS-
dc.subjectINTERMETALLIC COMPOUNDS-
dc.subjectPHOSPHORUS-CONTENT-
dc.subjectNI-P-
dc.subjectJOINTS-
dc.subjectSN-
dc.subjectMICROSTRUCTURES-
dc.subjectGROWTH-
dc.subjectALLOY-
dc.subjectCU-
dc.titleEffect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations-
dc.typeArticle-
dc.identifier.wosid000260377400017-
dc.identifier.scopusid2-s2.0-54949151844-
dc.type.rimsART-
dc.citation.volume37-
dc.citation.issue12-
dc.citation.beginningpage1858-
dc.citation.endingpage1862-
dc.citation.publicationnameJOURNAL OF ELECTRONIC MATERIALS-
dc.identifier.doi10.1007/s11664-008-0548-7-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorYu, Jin-
dc.contributor.nonIdAuthorXia, YH-
dc.contributor.nonIdAuthorLee, TY-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorSn-Ag-Al-
dc.subject.keywordAuthorlead-free solder-
dc.subject.keywordAuthorinterfacial reaction-
dc.subject.keywordAuthorintermetallic compound-
dc.subject.keywordPlusLEAD-FREE SOLDERS-
dc.subject.keywordPlusINTERMETALLIC COMPOUNDS-
dc.subject.keywordPlusPHOSPHORUS-CONTENT-
dc.subject.keywordPlusNI-P-
dc.subject.keywordPlusJOINTS-
dc.subject.keywordPlusSN-
dc.subject.keywordPlusMICROSTRUCTURES-
dc.subject.keywordPlusGROWTH-
dc.subject.keywordPlusALLOY-
dc.subject.keywordPlusCU-
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