Cu/Al 간 금속간화합물 형성이 Cu 와이어와 Al 패드의 접착력에 미치는 영향Effects of Cu/Al intermetallic compound(IMC) formation on Cu wire and Al pad bondability
- Advisors
- 백경욱researcher; Paik, Kyung-Wookresearcher
- Description
- 한국과학기술원 : 재료공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2002
- Identifier
- 174001/325007 / 020003155
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 재료공학과, 2002.2, [ iv, 73 p. ]
- Keywords
금속간화합물; 와이어 본딩; 전자패키징; 구리 와이어; Cu wire; intermetallic compound; wire bonding; electronic packaging
- Appears in Collection
- MS-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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