| 1 | 80Au-20Sn / 58Bi-42Sn 복합구조 솔더 접합부의 계면반응에 대한 연구 = Interfacial reaction in the solder joint of 80Au-20Sn / 58Bi-42Sn combination structurelink 양창준; Yang, Chang-Joon; et al, 한국과학기술원, 2005 |
| 2 | A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.32, pp.548 - 557, 2003-06 |
| 3 | A thermodynamic study of phase equilibria in the Au-Sb-Sn solder system Kim, JH; Jeong, SW; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.6, pp.557 - 563, 2002 |
| 4 | Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM Kim, Dong Hoon; Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.1, pp.39 - 45, 2009-01 |
| 5 | Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy Jeon, YD; Paik, Kyung-Wook; Ostmann, A; Reichl, H, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.80 - 90, 2005-01 |
| 6 | Effects of pad metallization on the low cycle fatigue characteristics of Sn-based solder joints Lee, K. O.; Yu, Jin; Park, T. S.; Lee, Soon-Bok, INTERNATIONAL JOURNAL OF FATIGUE, v.48, pp.1 - 8, 2013-03 |
| 7 | Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (UBM) Jang, Se-Young; Wolf, J; Ehrmann, O; Gloor, H; Reichl, H; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.25, no.3, pp.193 - 202, 2002-07 |
| 8 | Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200A degrees C, 500A degrees C, and 800A degrees C Chang, Jaewon; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.12, pp.2643 - 2652, 2010-12 |
| 9 | Sn-Ni-Zn 3원계의 상평형 = Phase equilibria in the Sn-Ni-Zn ternary systemlink 장재원; Chang, Jae-Won; et al, 한국과학기술원, 2010 |
| 10 | Tin Pest 방지 솔더합금의 크리프 특성 김성범; 유진; 손윤철, 마이크로전자 및 패키징학회지, v.12, no.1, pp.47 - 52, 2005-03 |
| 11 | Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-Bearing Pb-Free Solders on a Copper Substrate Jung, In-Yu; Cho, Moon-Gi; Lee, Hyuck-Mo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.11, pp.2301 - 2307, 2009-11 |
| 12 | β-Sn grain orientations in Pb-free solders and their effect on the reliability of solder joints = 무연 솔더의 β-Sn 결정립 방향성과 솔더 조인트 신뢰성에 미치는 영향link Seo, Sun-Kyoung; 서선경; et al, 한국과학기술원, 2010 |
| 13 | 무연 복합 솔더의 미소경도에 미치는 기계적 변형과 온도의 영향 이주원; 강성권; 이혁모, Journal of the Microelectronics and Packaging Society, v.12, no.2, pp.121 - 128, 2005-06 |
| 14 | 무연 솔더와 Ni-Cu 합금 UBM 간의 계면 반응 및 신뢰성에 관한 연구 = Study on the reaction and reliability of Ni-Cu alloy UBM with Pb-free solderslink 한훈; Han, Hun; et al, 한국과학기술원, 2005 |
| 15 | 저온용 무연 솔더 합금, Sn-In-Bi 3원계의 상평형 열역학 분석 및 상태도 계산 = Phase equilibrium thermodynamic analysis and phase diagram calculation of the low-temperature Pb-free solder, Sn-In-Bi systemlink 노병섭; Roh, Byung-Sup; et al, 한국과학기술원, 1996 |
| 16 | 전기화학적 환원분석을 통한 무연 솔더합금의 산화에 대한 연구 조성일; 유진; 강성권; Shih, Da-Yuan, 마이크로전자 및 패키징학회지, v.12, no.1, pp.35 - 40, 2005-03 |
| 17 | 전해도금 Cu와 Sn-3.5Ag 솔더 접합부의 Kirkendall void 형성과 충격 신뢰성에 관한 연구 김종연; 유진, 마이크로전자 및 패키징학회지, v.15, no.1, pp.33 - 37, 2008-03 |
