Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject INTERFACIAL REACTIONS
Showing results 1 to 19 of 19
| Effect of Cu content on the mechanical reliability of Ni/Sn-3.5Ag system Kim, JY; Sohn, YC; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.22, no.3, pp.770 - 776, 2007-03 |
| Effect of oxidation of SiC particles on mechanical properties and wear behavior of SiCp/Al6061 composites Trinh, Pham Van; Lee, Junho; Phan Ngoc Minh; Doan Dinh Phuong; Hong, Soon Hyung, JOURNAL OF ALLOYS AND COMPOUNDS, v.769, pp.282 - 292, 2018-11 |
| Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad Jee, YK; Ko, YH; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.22, no.7, pp.1879 - 1887, 2007-07 |
| Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly Kim, Youngsoon; Lee, Seyong; Shin, Ji Won; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.45, no.6, pp.3208 - 3219, 2016-06 |
| Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn-3.5Ag solder joints Kim, J. Y.; Yu, Jin; Kim, Sung-Hwan, ACTA MATERIALIA, v.57, pp.5001 - 5012, 2009-10 |
| Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders Cho, Moon Gi; Kang, Sung K.; Seo, Sun-Kyoung; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.24, no.2, pp.534 - 543, 2009-02 |
| Electromigration Performance of Pb-free Solder Joints in Terms of Solder Composition and Joining Path Seo, Sun-Kyoung; Kang, Sung K.; Cho, Moon Gi; Lee, HyuckMo, JOM, v.62, no.7, pp.22 - 29, 2010-07 |
| Fabrication of Protective-coated SiC Reinforced Tungsten Matrix Composites with Reduced Reaction Phases by Spark Plasma Sintering Umer, Malik Adeel; Lee, Dongju; Waseem, Owais Ahmed; Ryu, Ho Jin; Hong, Soon Hyung, METALS AND MATERIALS INTERNATIONAL, v.22, no.3, pp.493 - 500, 2016-05 |
| Formation of intermetallic compounds in the Ni bearing lead free composite solders Lee, JW; Lee, ZH; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.46, no.11, pp.2344 - 2350, 2005-11 |
| In-situ isothermal aging TEM analysis of a micro Cu/ENIG/Sn solder joint for flexible interconnects Liu, Jinhong; Xu, Jianhao; Paik, Kyung-Wook; He, Peng; Zhang, Shuye, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, v.169, pp.42 - 52, 2024-01 |
| Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy Jang, Dong-Min; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.26, no.24, pp.3032 - 3037, 2011-12 |
| Microstructure and mechanical properties of SiC-nanowire-augmented tungsten composites Lee, Dongju; Park, Heesub; Ryu, Ho Jin; Jeon, Seokwoo; Hong, Soon-Hyung, JOURNAL OF ALLOYS AND COMPOUNDS, v.509, no.37, pp.9060 - 9064, 2011-09 |
| Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study Jang, SY; Wolf, J; Ehrmann, O; Reichl, H; Paik, Kyung-Wook, MICROSYSTEM TECHNOLOGIES, v.7, no.5-6, pp.269 - 272, 2002-01 |
| Secondary IMC formation induced by Kirkendall voiding in Cu/Sn-3.5Ag solder joints Kim, Sung-Hwan; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.25, no.9, pp.1854 - 1858, 2010-09 |
| The evolution of microstructure and microhardness of Sn-Ag and Sn-Cu solders during high temperature aging Seo, Sun-Kyoung; Kang, Sung K.; Shih, Da-Yuan; Lee, HyuckMo, MICROELECTRONICS RELIABILITY, v.49, no.3, pp.288 - 295, 2009-03 |
| Thermodynamic assessment of the Ni-Bi binary system and phase equilibria of the Sn-Bi-Ni ternary system Seo, Sun-Kyoung; Cho, Moon Gi; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.11, pp.1536 - 1544, 2007-11 |
| (UBM)Under bump metallurgy study for Pb-free bumping Jang, SY; Wolf, J; Gloor, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.478 - 487, 2002-05 |
| Undercooling and microhardness of Pb-free solders on various under bump metallurgies Cho, Moon Gi; Kang, Sung K.; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.23, no.4, pp.1147 - 1154, 2008-04 |
| Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.50, no.9, pp.2291 - 2296, 2009-09 |
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