Thermodynamic assessment of the Ni-Bi binary system and phase equilibria of the Sn-Bi-Ni ternary system

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As a basis to understand the interfacial reaction between the Sn-Bi solder and the Ni substrate in electronic packaging, thermodynamic calculations of phase equilibria have been carried out on the binary Ni-Bi system. The Gibbs free energy of the NiBi phase has been approximated, using a three-sublattice model, and thermodynamic parameters have been evaluated, using available experimental information on phase boundaries and other related thermodynamic properties. The calculated phase diagram and thermodynamic quantities of the Ni-Bi binary system showed good agreement with the experimental data. The Sn-Bi-Ni ternary system was calculated using the thermodynamic parameters of the Sn-Bi, Sn-Ni, and Ni-Bi binary systems, and it was compared with experimental measurements.
Publisher
Springer
Issue Date
2007-11
Language
English
Article Type
Article; Proceedings Paper
Keywords

NICKEL-BISMUTH; INTERFACIAL REACTIONS; SOLDER ALLOYS; SUBSTRATE; CU

Citation

JOURNAL OF ELECTRONIC MATERIALS, v.36, no.11, pp.1536 - 1544

ISSN
0361-5235
URI
http://hdl.handle.net/10203/86790
Appears in Collection
MS-Journal Papers(저널논문)
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