Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad

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Varying, amounts of Zn (1, 3, and 7 wt%) were added to Sn-3.5Ag solder on a Cu pad, and the resultant solder joint microstructures after a reflow and isothermal aging (150 degrees C, up to 500 h) were investigated using scanning electron microscopy, energy dispersive x-ray, and x-ray diffraction, which were subsequently correlated to the results of microhardness and drop tests. Zinc was effective in improving the drop resistance of Sn-3.5Ag solder on the Cu pad, and an addition of 3 wt% Zn nearly doubled the number of drops-to-failure (N-f). The beneficial role of Zn was ascribed to suppression of Cu6Sn5 and precipitation of Zn-containing intermetallic compounds (IMCs). However, the Zn effect was reduced as Cu6Sn5 and Ag3Sn precipitated in a joint IMC layer after prolonged aging. The interface between Ag5Zn8 and Cu5Zn8 was resistant to drop impact, but two other layered IMC structures of Cu6Sn5/Cu3Sn and Cu5Zn8/Cu6Sn5 were not.
Publisher
CAMBRIDGE UNIV PRESS
Issue Date
2007-07
Language
English
Article Type
Article
Keywords

LEAD-FREE SOLDERS; INTERFACIAL REACTIONS; MECHANICAL-PROPERTIES; AG SOLDER; P CONTENT; MICROSTRUCTURE; JOINTS; STRENGTH; GROWTH; ALLOY

Citation

JOURNAL OF MATERIALS RESEARCH, v.22, no.7, pp.1879 - 1887

ISSN
0884-2914
DOI
10.1557/jmr.2007.0234
URI
http://hdl.handle.net/10203/89713
Appears in Collection
MS-Journal Papers(저널논문)
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