Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Lee, BW

Showing results 1 to 6 of 6

1
Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages

Lee, BW; Jang, W; Kim, DW; Jeong, J; Nah, JW; Paik, Kyung-Wook; Kwon, D, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.380, pp.231 - 236, 2004-08

2
Determination of Stress-Strain Curve for Microelectronic Solder Joint by ESPI Measurement and FE Analaysis

Lee, BW; Jeong, JH; Jang, WS; Kim, JY; Kim, DW; Kwon, DI; Nah, JW; et al, The Third International Conference On Advanced Materials Development and Performance, Kyungpook National University, 2002-10

3
Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis

Lee, BW; Jeong, JH; Jang, W; Kim, JY; Kim, DW; Kwon, D; Nah, JW; et al, The Third International Conference On Advanced Materials Development and Performance, v.17, pp.1983 - 1988, The Third International Conference On Advanced Materials Development and Performance, 2003

4
Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis

Lee, BW; Jeong, JH; Jang, W; Kim, JY; Kim, DW; Kwon, D; Nah, JW; et al, INTERNATIONAL JOURNAL OF MODERN PHYSICS B, v.17, pp.1983 - 1988, 2003-04

5
Effect of a TiO2 buffer layer on the CV properties of Pt/PbTiO3/TiO2/Si structure

Byun, C; Kim, YI; Lee, Won-Jong; Lee, BW, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.36, no.9A , pp.5588 - 5589, 1997-04

6
Evaluation of Thermal Shear Strains in Flips-chip Package by Electronic Speckle Pattern Interferometry (ESPI)

Jang, W; Lee, BW; Kim, DW; Nah, JW; Paik, Kyung-Wook; Kwon, D, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2001, pp.310 - 314, 2001-11

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