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Showing results 1 to 8 of 8

1
A Study of Sn Whisker Growth using minor Alloying Addition, and Plastic Deformation

Chang, Jaewon; Kang, Sung Kwon; Lee, Jae-Ho; Kim, Keun-Soo; Lee, Hyuck Mo, The 15th International Conference on Electronic Materials and Packaging, The Korean Microelectronics and Packaging Society, 2013-10-08

2
Effect of Plastic Deformation on Sn Whisker Growth in Electroplated Sn and Sn-Ag

Chang, Jaewon; Kang, Sung; Lee, Jaeho; Kim, Keun-Soo; Lee, Hyuck Mo, 2013 TMS annual meeting (142nd), The Minerals, Metals & Materials Society, 2013-03-06

3
Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Aging Conditions

Chang, Jaewon; Kang, Sung; Lee, Jaeho; Kim, Keun-Soo; Lee, Hyuck Mo, 2013 TMS annual meeting (142nd), The Minerals, Metals & Materials Society, 2013-03-04

4
Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions

Chang, Jaewon; Kang, Sung K.; Lee, Jae-Ho; Kim, Keun-Soo; Lee, Hyuck Mo, JOURNAL OF ELECTRONIC MATERIALS, v.43, no.1, pp.259 - 269, 2014-01

5
Microstructural discovery of Al addition on Sn-0.5Cu-based Pb-free solder design

Koo, Jahyun; Lee, Changsoo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck-Mo, JOURNAL OF ALLOYS AND COMPOUNDS, v.650, pp.106 - 115, 2015-11

6
New Sn-0.7Cu-based solder alloys with minor alloying additions of Pd, Cr and Ca

Koo, Jahyun; Chang, Jaewon; Lee, Young Woo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck Mo, JOURNAL OF ALLOYS AND COMPOUNDS, v.608, pp.126 - 132, 2014-09

7
Plastic Deformation Effect on Sn Whisker Growth in Electroplated Sn and Sn-Ag Solders

Kang, Sung-Kwon; Chang, Jaewon; Lee, Hyuck Mo; Lee, Jae-Ho; Kim, Keun-Soo, The 63rd Electronic Components and Technology Conference (ECTC 2013), pp.1018 - 1023, IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society, 2013-05-30

8
Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed Sn Films

Chang, Jaewon; Kang, Sung K.; Lee, Jae-Ho; Kim, Keun-Soo; Lee, Hyuck Mo, JOURNAL OF ELECTRONIC MATERIALS, v.44, no.10, pp.3486 - 3499, 2015-10

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