DSpace at KOASAS
College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Plastic Deformation Effect on Sn Whisker Growth in Electroplated Sn and Sn-Ag Solders

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 153
  • Download : 0
Export
Kang, Sung-Kwon / Chang, Jaewon / Lee, Hyuck Moresearcher / Lee, Jae-Ho / Kim, Keun-Soo
Publisher
IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society
Issue Date
2013-05-30
Language
English
Citation

The 63rd Electronic Components and Technology Conference (ECTC 2013), pp.1018 - 1023

URI
http://hdl.handle.net/10203/258320
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

Display Full Item Record

qr_code

  • mendeley

    citeulike

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.


rss_1.0 rss_2.0 atom_1.0