Showing results 1 to 4 of 4
Stencil printing으로 형성한 Pb-free solder bump와 UBM(under bump metallurgy) 간의 계면에 관한 연구 = Interfacil studies on the stencil printed Pb-free solder bump and UBM (under bump metallurgy)link 엄지용; Eom, Ji-Yong; et al, 한국과학기술원, 2000 |
Thermodynamic Prediction of Interface Reaction Phases at Cu/Solder Joints Lee, HyuckMo; Yoon, Seung Wook; Lee, Byeong-Joo, JOURNAL OF ELECTRONIC MATERIALS, v.27, no.11, pp.1161 - 1166, 1998 |
아연과 주석을 이용한 고온용 무연솔더 설계 및 특성평가 = Zn-Sn based new solder designs and reliability tests of high-temperature lead-free solderlink 문종규; Moon, Jong-Kkyu; et al, 한국과학기술원, 2011 |
전해도금을 이용한 Ni계 UBM 및 Sn-Ag 솔더 범프 형성 방법 = Fabrication method of Ni based under bump metallurgy and sn-ag solder bump by electroplatinglink 김종연; Kim, Jong-Yeon; et al, 한국과학기술원, 2003 |
Discover