Stencil printing으로 형성한 Pb-free solder bump와 UBM(under bump metallurgy) 간의 계면에 관한 연구 = Interfacil studies on the stencil printed Pb-free solder bump and UBM (under bump metallurgy)

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Advisors
이원종researcherLee, Won-Jongresearcher
Description
한국과학기술원 : 재료공학과,
Publisher
한국과학기술원
Issue Date
2000
Identifier
158611/325007 / 000983336
Language
kor
Description

학위논문(석사) - 한국과학기술원 : 재료공학과, 2000.2, [ v, 101 p. ]

Keywords

금속간 화합물; 하부 금속층; 무연 솔더 범프; 스탠실 프린팅; 파단면; Fractured interface; Intermetallic compound; UBM; Pb-free solder bump; Stencil printing

URI
http://hdl.handle.net/10203/50784
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=158611&flag=dissertation
Appears in Collection
MS-Theses_Master(석사논문)
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