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Studies on the reliabilities of BGA system-in-package (SiP) with an embedded die = 칩이 내장되어 있는 BGA 타입 system-in-package의 신뢰성에 대한 연구link Yu, Seon-Young; 유선영; et al, 한국과학기술원, 2011 |
Studies on the reliabilities of BGA system-in-package (SiP) with an embedded die = 칩이 내장되어 있는 BGA 타입 system-in-package의 신뢰성에 대한 연구link Yu, Seon-Young; 유선영; et al, 한국과학기술원, 2011 |
Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) with an Embedded Die Yu, Seon-Young; Kwon, Yong-Min; Kim, Jin-Su; Jeong, Tae-Sung; Choi, Seog-Moon; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.4, pp.625 - 633, 2012-04 |
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