Studies on the reliabilities of BGA system-in-package (SiP) with an embedded die

Abstract

Nowadays, many electronic products have become multifunctional and small. To follow this trend, SiP package is needed and used for many products now. Among SiP, embedded die SiP package become popular due to smaller size from embedded die and higher electrical performance from shorter interconnection length. However, the reliability issues of embedded die SiP will occur due to complicated structure of it. Therefore system-in-package (SiP) with an embedded die also needs reliability data and the effect of embedded die on the SiP reliability was investigated. Drop, bending and thermal cycling test were performed to board level package samples and pre-conditioning (pre-con) test was performed to module level samples. Also, finite element method (FEM) simulation was done to find out what position of BGA solder is weak during thermal cycling test. Through drop and bending reliability tests, it is found that the embedded die did not affect reliability of SiP package means failure position was corner of BGA solder. However, in the T/C test the failed BGA bumps position was different from that of prevalent package that consist of simply die and board using BGA bumps due to the structure of package.