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Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject electroplating

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Showing results 15 to 22 of 22

15	Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09
16	Residual stress effect on self-annealing of electroplated copper Lee, CH; Park, Chong-Ook, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.42, no.7, pp.4484 - 4488, 2003-07
17	Sodium Borohydride의 수소 발생을 위한 다공성 Co-P 촉매 조근우; 권혁상; 엄광섭, 한국수소및신에너지학회논문집, v.17, no.4, pp.448 - 453, 2006-12
18	The effects of electroplating parameters on the composition and morphology of Sn-Ag solder Kim, JY; Yu, Jin; Lee, JH; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.12, pp.1459 - 1464, 2004-12
19	(UBM)Under bump metallurgy study for Pb-free bumping Jang, SY; Wolf, J; Gloor, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.478 - 487, 2002-05
20	나노템플릿을 이용한 금속 나노와이어 성장에 관한 연구 = A study on the growth of metal nanowires based on template method link 신호선; Shin, Ho-Sun; et al, 한국과학기술원, 2007
21	전해 및 무전해 도금법으로 제작된 ACF 접합용 Ni bump 특성에 관한 연구 = A comprarative study on the characterization of Ni bumps fabricated by electro and electroless plating for ACF link 진경선; Jin, Kyoung-Sun; et al, 한국과학기술원, 2006
22	전해도금에 의한 미세 공정 Sn-Bi 솔더 범프 제작에 관한 연구 = Fabrication of small eutectic Sn-Bi solder bumps by electroplating link 정회록; Jung, Hoe-Rok; et al, 한국과학기술원, 2003

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