Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Lee, JS

Showing results 22 to 47 of 47

22
Fabrication and characterization of BaxSr1-xTiO3/YBa(2)Cu3O(x)/SrTiO3 structure

Choi, J; Kim, E; Park, SY; Lee, JS; Sung, TH; Park, Y; No, Kwangsoo, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.41, no.9, pp.5567 - 5571, 2002-09

23
Fabrication and characterization of electrically tunable high-T-c superconducting resonators incorporating barium strontium titanate as a tuning material

Lee, EH; Sok, J; Park, SJ; Lee, JS; Song, IH; Kwak, J; Jung, KR; et al, SUPERCONDUCTOR SCIENCE TECHNOLOGY, v.12, no.11, pp.981 - 984, 1999-11

24
Field emission characteristics of COSi2/TaN-coated silicon emitter tips

Han, BW; Lee, JS; Ahn, Byung Tae, IEEE ELECTRON DEVICE LETTERS, v.23, no.1, pp.10 - 12, 2002-01

25
Fluorinated silicon nitride film for the bottom antireflective layer in quarter micron optical lithography

Jun, BH; Han, SS; Lee, JS; Kim, YB; Kang, HY; Koh, YB; Bae, Byeong-Soo; et al, SEMICONDUCTOR SCIENCE AND TECHNOLOGY, v.12, no.7, pp.921 - 926, 1997-07

26
Formability of Superplastic Al Alloy Sheets

Lee, Hyuck Mo; Lee, DN; Jeong, SK; Choi, JH; Hong, SH; Hong, SS; Lee, JS, Conference on Superplastic Forming

27
Formation and Characterization of Co-Reinforced Sn-3.5Ag Solder

Jeon, Duk Young; Lee, JS; Chu, KM; Patzelt, R; Manessis, D; Ostmann, A, KAIST/GIST/Postech/Kyoto/Tohoku Univ. Joint Symposium, 2006

28
Formation and characterization of cobalt-reinforced Sn-3.5Ag solder

Lee, JS; Chu, KM; Jeon, Duk Young; Patzelt, R; Manessis, D; Ostmann, A, IEEE 56th Electronic Components and Technology Conference, pp.244 - 249, IEEE, 2006-05-30

29
Formation of Equilibrium and Metastable Eutectics Near the Ni3Al Composition

Wee, Dang-Moon; Lee, JS; Lu, Y; Lee, JH; Oh, MH; Hirano, T, 2004 MST meeting (TMS Fall meeting), 2004

30
Formation of fine pitch solder bumps on polytetrafluoroethylene printed circuit board using dry film photoresist

Lee, JS; Chu, KM; Park, HyoHoon; Jeon, DukYoung, Proceedings of 2004 International IEEE Conference on Asian Green Electronics (AGEC), pp.117 - 122, AGEC, 2004-01-05

31
Formation of Sn-multiwalled carbon nanotube composite layer for the application of thermal interface materials

Lee, JS; Vaidyanathan, S; Jeon, Duk Young, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 123, 2007-11-19

32
Improvement of adhesion and microwave transmission characteristics of indium bump by silver coating for low temperature flip-chip applications

Chu, KM; Choi, JH; Lee, JS; Cho, HS; Park, SeongOok; Park, HyoHoon; Jeon, DukYoung, Materials, Intergration and Packaging Issues for High-Frequency Devices II, pp.75 - 80, Materials Research Society Symposium, 2004-11-29

33
Isopropanol Effects On The Phase-Formation And Texturing Of Sol-Gel Derived PMN Thin-Films

Lee, JS; Kim, CJ; Yoon, DS; Choi, CG; Woo, SS; No, Kwangsoo, JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, v.34, no.6A, pp.716 - 719, 1995-06

34
Mass spectroscopic study for vaporization characteristics of Ba(TMHD)(2) and Sr(TMHD)(2) in electron cyclotron resonance-plasma enhanced metal organic chemical vapor deposition

Lee, JS; Song, HW; Kim, KS; Yu, BG; Jeong, YH; Jiang, ZT; No, Kwangsoo, JOURNAL OF VACUUM SCIENCE TECHNOLOGY A-VACUUM SURFACES AND FILMS, v.15, no.1, pp.72 - 76, 1997

35
Multiple Flip-chip Assembly for Hybrid Compact Optoelectronic Modules using Electroplated AuSn Solder Bumps

Jeon, Duk Young; Chu, KM; Lee, JS; Oppermann, H; Engelmann, G; Wolf, J; Reichl, H, IMAPS 2006 (39th International Symposium on Microelectronics 2006), pp.653 -, 2006

36
Optoelectronic and microwave characteristics of silver coated indium bumps for low temperature flip-chip applications

Chu, KM; Choi, JH; Lee, JS; Cho, HS; Park, SeongOok; Park, HyoHoon; Jeon, DukYoung, ELECTRONICS LETTERS, v.40, no.23, pp.1508 - 1509, 2004-11

37
Preparation and characterization of coenzyme Q(10)-loaded PMMA nanoparticles by a new emulsification process based on microfluidization

Kwon, SS; Nam, YoonSung; Lee, JS; Ku, BS; Han, SH; Lee, JY; Chang, IS, COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS, v.210, no.1, pp.95 - 104, 2002-10

38
Shear strength of Sn-3.5Ag solder bumps formed on Ni/Au and organic solderability preservative surface-finished bond pads after multiple reflow steps

Lee, JS; Chu, KM; Jeon, DukYoung, JOURNAL OF MATERIALS RESEARCH, v.20, no.11, pp.3088 - 3093, 2005-11

39
Solid-phase synthesis of styryl dyes and their application as amyloid sensors

Li, QA; Lee, JS; Ha, C; Park, Chan Beum; Yang, G; Gan, WB; Chang, YT, ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, v.43, no.46, pp.6331 - 6335, 2004

40
Strategy to Control Defects in Graphene Synthesis and Its Effect to Material Properties

Song, SH; Lee, JS; Jin, SH; Hwang, JW; Back, JU; Kim, JM; Kim, BH; et al, 2013 RPGR (Recent Progress in Graphene Research) conferences, RPGR, 2013-09-12

41
Successive Multiple Flip-chip Assembly using Gold-tin Solder Bump for a Compact Optoelectronic Module

Jeon, Duk Young; Chu, KM; Lee, JS; Oppermann, H; Engelmann, G; Wolf, J; Reichl, H, 2006 Microoptics Conference (The Joint International Conference on Plastic Optical Fiber and Microoptics 2006), pp.78 -, 2006

42
Synthesis and photoluminescence properties of BaGa2S 4: Eu2+ phosphor for white light-emitting diodes

Yoo, HS; Park, BJ; Im, WB; Lee, JS; Jeon, Duk Young, 14th International Display Workshops, IDW '07, pp.953 - 955, 123, 2007-12-05

43
Synthesis of low temperature burnable P(MMA-co-BMA) binder and control of carbon residue during baking process of BAM phosphor paste

Kim, SW; Lee, S; Im, WB; Lee, JS; Jang, HS; Yoo, HS; Jeon, Duk Young, 14th International Display Workshops, IDW '07, pp.877 - 879, 2007-12-05

44
TEXTURING AND ELECTRICAL CHARACTERISTICS OF SOL-GEL DERIVED FERROELECTRIC THIN-FILMS

No, Kwangsoo; Kim, CJ; Yoon, DS; Lee, JS; Choi, CG; Lee, Won-Jong; Bae, Byeong-Soo, INTEGRATED FERROELECTRICS, v.9, no.1-3, pp.159 - 168, 1995

45
THERMAL STABILITIES AND MICROSTRUCTURES OF TUNGSTEN COMPOUND CONTACTS ON N-GAAS FABRICATED BY LOW-ENERGY ION-BEAM-ASSISTED DEPOSITION

Park, Chul Soon; Lee, JS; Kang, JY; Lee, Jeong Yong, APPLIED PHYSICS LETTERS, v.59, no.14, pp.1767 - 1769, 1991-09

46
Titanium oxide film for the bottom antireflective layer in deep ultraviolet lithography

Jun, BH; Han, SS; Kim, KS; Lee, JS; Jiang, ZT; Bae, Byeong-Soo; No, Kwangsoo; et al, APPLIED OPTICS, v.36, no.7, pp.1482 - 1486, 1997-03

47
Vitamin A microencapsulation within poly(methyl methacrylate)-g-polyethylenimine microspheres: Localized proton buffering effect on vitamin A stability

Lee, JS; Nam, YoonSung; Kang, BY; Han, SH; Chang, IS, JOURNAL OF APPLIED POLYMER SCIENCE, v.92, pp.517 - 522, 2004-04

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