DSpace at KOASAS
Browsing DSpace

Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Type Patent

A to Z

All 0-9

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:

Showing results 111 to 130 of 1225

111
Magnetic device with gate electrode

Park, Byong-Guk; Kang, Min-Gu; Choi, Jong-Guk

112
Magnetic logic device

Park, Byong-Guk; Kim, Kab-Jin; Lee, Geun-hee

113
MANUFACTURING METHOD FOR FLEXIBLE DEVICE, FLEXIBLE DEVICE, SOLAR CELL, AND LIGHT EMITTING DEVICE

Lee, Keon Jae; Lee, Sangyong

114
MANUFACTURING METHOD FOR FLEXIBLE DEVICE, FLEXIBLE DEVICE, SOLAR CELL, AND LIGHT EMITTING DEVICE

Lee, Keon Jae; Lee, Sangyong

115
MANUFACTURING METHOD FOR FLEXIBLE DEVICE, FLEXIBLE DEVICE, SOLAR CELL, AND LIGHT EMITTING DEVICE

Lee, Keon Jae; Lee, Sangyong

116
MANUFACTURING METHOD FOR FLEXIBLE DEVICE, FLEXIBLE DEVICE, SOLAR CELL, AND LIGHT EMITTING DEVICE

Lee, Keon Jae; Lee, Sangyong

117
Member for gas sensor, having a metal oxide semiconductor tube wall with micropores and macropores, gas sensor, and method for manufacturing same

Kim, Il-Doo; Jang, Ji Su; Kim, Sang-Joon; Choi, Seon-Jin, 2019-04-30

118
Member for gas sensor, having a metal oxide semiconductor tube wall with micropores and macropores, gas sensor, and method for manufacturing same

Kim, Il-Doo; Ji Su Jang; Kim, Sang-Joon; Choi, Seon-Jin

119
Method and apparatus for multiplexed imaging of spectrally-similar fluorophores

Chang, Jae-Byum; Yoon, Young-Gyu; Seo, Junyoung; Sim, Yeonbo

120
Method for bonding between electrical devices using ultrasonic vibration

Paik, Kyung-Wook; Yim, Myung-jin; Kim, Hyoung-joon; Lee, Ki-won

121
Method for fabricating carbon nanotube-metal-polymer nanocomposites

홍순형, 2011-09-07

122
Method for fabricating chip size packages using lamination process

Paik, Kyung-Wook; Jang, Se Young

123
Method for fabricating epitaxial cobalt-disilicide layers using cobalt-nitride thin film

안병태, 2006-09-12

124
Method for fabricating wafer-level flip chip package using pre-coated anisotropic conductive adhesive

백경욱, 2003-02-11

125
Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method

Paik, Kyung-Wook; Nah, Jae Woong; Jeon, Young Doo; Yim, Myung Jin

126
Method for forming SBT ferroelectric thin film

Kim, Ho-Gi; Lee, Won Jae; Yoon, Soon Gil; Ahn, Joon Hyung

127
Method for Making Barium Titanate Dielectrics

Kang, Suk-Joong L; Lee, Byung Ke; Lee, Ho Yong; Chung, Sung Yoon, 2001-09-20

128
Method for making BaTiO3-based dielectric

강석중, 2002-03-19

129
Method for making n-type semiconductor diamond

Yu, Jin; Lee, Woong Sun; Kim, Jung Keun, 2000-08-01

130
METHOD FOR MANUFACTURING A SILICON NITRIDE SINTERED BODY WITH HIGH THERMAL CONDUCTIVITY

Kim, Do Kyung; Lee, Hyun Min; Seog, In-Sig

Discover

rss_1.0 rss_2.0 atom_1.0