Coupling of through-hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB
- Publisher
- IEEE
- Issue Date
- 2003-08-18
- Language
- English
- Citation
2003 IEEE Symposium on Electromagnetic Compatibility, pp.231 - 235
- ISSN
- 0190-1494
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
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