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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Coupling of through-hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB

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dc.contributor.authorPak, J.S.ko
dc.contributor.authorKim, J.ko
dc.contributor.authorLee, H.ko
dc.contributor.authorByun, J.-G.ko
dc.contributor.authorKim, Jounghoko
dc.date.accessioned2010-03-24T05:20:44Z-
dc.date.available2010-03-24T05:20:44Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2003-08-18-
dc.identifier.citation2003 IEEE Symposium on Electromagnetic Compatibility, pp.231 - 235-
dc.identifier.issn0190-1494-
dc.identifier.urihttp://hdl.handle.net/10203/17303-
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleCoupling of through-hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB-
dc.typeConference-
dc.identifier.wosid000185677200045-
dc.identifier.scopusid2-s2.0-0141940095-
dc.type.rimsCONF-
dc.citation.beginningpage231-
dc.citation.endingpage235-
dc.citation.publicationname2003 IEEE Symposium on Electromagnetic Compatibility-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationBoston, MA-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorPak, J.S.-
dc.contributor.nonIdAuthorKim, J.-
dc.contributor.nonIdAuthorLee, H.-
dc.contributor.nonIdAuthorByun, J.-G.-
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