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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

감광물질의 열적 reflow 를 이용한 MEMS 응용에서의 접합 공정Photoresist Thermal Reflow Bonding for MEMS Application

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임성혁 / 강현욱 / 윤상열 / 성형진researcher
Publisher
한국정밀공학회
Issue Date
2011-06-01
Language
KOR
Citation

한국정밀공학회 2011년도 춘계학술대회 , v.11, pp.179 - 180

URI
http://hdl.handle.net/10203/165928
Appears in Collection
ME-Conference Papers(학술회의논문)
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