감광물질의 열적 reflow 를 이용한 MEMS 응용에서의 접합 공정Photoresist Thermal Reflow Bonding for MEMS Application
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 임성혁 | - |
| dc.contributor.author | 강현욱 | - |
| dc.contributor.author | 윤상열 | - |
| dc.contributor.author | 성형진 | - |
| dc.date.accessioned | 2013-03-28T13:01:43Z | - |
| dc.date.available | 2013-03-28T13:01:43Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2011-06-01 | - |
| dc.identifier.citation | 한국정밀공학회 2011년도 춘계학술대회 , v.11, no., pp.179 - 180 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/165928 | - |
| dc.language | KOR | - |
| dc.publisher | 한국정밀공학회 | - |
| dc.title | 감광물질의 열적 reflow 를 이용한 MEMS 응용에서의 접합 공정 | - |
| dc.title.alternative | Photoresist Thermal Reflow Bonding for MEMS Application | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.volume | 11 | - |
| dc.citation.beginningpage | 179 | - |
| dc.citation.endingpage | 180 | - |
| dc.citation.publicationname | 한국정밀공학회 2011년도 춘계학술대회 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | 성형진 | - |
| dc.contributor.nonIdAuthor | 임성혁 | - |
| dc.contributor.nonIdAuthor | 강현욱 | - |
| dc.contributor.nonIdAuthor | 윤상열 | - |
- Appears in Collection
- ME-Conference Papers(학술회의논문)
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