The effects of the degree of cure of anisotropic conductive films (ACFs) on the contraction stress build-up of ACFs and ACF joints stability for ACF FlipChip interconnection
- Publisher
- 123
- Issue Date
- 2008-10-22
- Language
- English
- Citation
2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.20 - 24
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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