The effects of the degree of cure of anisotropic conductive films (ACFs) on the contraction stress build-up of ACFs and ACF joints stability for ACF FlipChip interconnection
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Chung, CK | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2013-03-19T04:47:22Z | - |
| dc.date.available | 2013-03-19T04:47:22Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2008-10-22 | - |
| dc.identifier.citation | 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.20 - 24 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/155874 | - |
| dc.language | English | - |
| dc.publisher | 123 | - |
| dc.title | The effects of the degree of cure of anisotropic conductive films (ACFs) on the contraction stress build-up of ACFs and ACF joints stability for ACF FlipChip interconnection | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000264237400001 | - |
| dc.identifier.scopusid | 2-s2.0-64049110494 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 20 | - |
| dc.citation.endingpage | 24 | - |
| dc.citation.publicationname | 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 | - |
| dc.identifier.conferencecountry | CH | - |
| dc.identifier.conferencelocation | Taipei | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Chung, CK | - |
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