미세전자 패키징용 이방성 전도성 접착제 기술의 최신동향 (Reccnt Advances in Anisotropic Conductive Adhesives (ACAs) for Microelectronic Packaging Applications)Reccnt Advances in Anisotropic Conductive Adhesives (ACAs) for Microelectronic Packaging Applications
- Issue Date
- 2005
- Language
- KOR
- Citation
한국 마이크로 전자 및 패키징 학회-(IMAPS-Korea) 2005년도 추계기술 심포지움, pp.20 - 24
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.