미세전자 패키징용 이방성 전도성 접착제 기술의 최신동향 (Reccnt Advances in Anisotropic Conductive Adhesives (ACAs) for Microelectronic Packaging Applications)Reccnt Advances in Anisotropic Conductive Adhesives (ACAs) for Microelectronic Packaging Applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 백경욱 | - |
| dc.contributor.author | 임명진 | - |
| dc.contributor.author | 황진상 | - |
| dc.date.accessioned | 2013-03-18T18:04:40Z | - |
| dc.date.available | 2013-03-18T18:04:40Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2005 | - |
| dc.identifier.citation | 한국 마이크로 전자 및 패키징 학회-(IMAPS-Korea) 2005년도 추계기술 심포지움, v., no., pp.20 - 24 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/151026 | - |
| dc.language | KOR | - |
| dc.title | 미세전자 패키징용 이방성 전도성 접착제 기술의 최신동향 (Reccnt Advances in Anisotropic Conductive Adhesives (ACAs) for Microelectronic Packaging Applications) | - |
| dc.title.alternative | Reccnt Advances in Anisotropic Conductive Adhesives (ACAs) for Microelectronic Packaging Applications | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 20 | - |
| dc.citation.endingpage | 24 | - |
| dc.citation.publicationname | 한국 마이크로 전자 및 패키징 학회-(IMAPS-Korea) 2005년도 추계기술 심포지움 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | 백경욱 | - |
| dc.contributor.nonIdAuthor | 임명진 | - |
| dc.contributor.nonIdAuthor | 황진상 | - |
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