Effects of Electrical Current on the Failure Mechanisms of Au stud bumps/ACF Flip Chip Joints under High Current Stressing Condition
- Issue Date
- 2003-11
- Language
- ENG
- Citation
5th International Conference on Electronic Materials and Packaging, pp.203 - 208
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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