Effects of Electrical Current on the Failure Mechanisms of Au stud bumps/ACF Flip Chip Joints under High Current Stressing Condition
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, HJ | - |
| dc.contributor.author | Kwon, WS | - |
| dc.contributor.author | Paik, Kyung-Wook | - |
| dc.date.accessioned | 2013-03-18T07:08:16Z | - |
| dc.date.available | 2013-03-18T07:08:16Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2003-11 | - |
| dc.identifier.citation | 5th International Conference on Electronic Materials and Packaging, v., no., pp.203 - 208 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/145846 | - |
| dc.language | ENG | - |
| dc.title | Effects of Electrical Current on the Failure Mechanisms of Au stud bumps/ACF Flip Chip Joints under High Current Stressing Condition | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 203 | - |
| dc.citation.endingpage | 208 | - |
| dc.citation.publicationname | 5th International Conference on Electronic Materials and Packaging | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Kim, HJ | - |
| dc.contributor.nonIdAuthor | Kwon, WS | - |
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