Flip-Chip-on-Glass(FCOG) Technology using Electroless Ni/Cu/Au bump and ACF for LCD Packaging
- Issue Date
- 1999-09-01
- Language
- ENG
- Citation
Liquid Crystal Materials and Device '99, pp.199 - 204
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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