Flip-Chip-on-Glass(FCOG) Technology using Electroless Ni/Cu/Au bump and ACF for LCD Packaging
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung-Wook | - |
| dc.date.accessioned | 2013-03-16T22:43:34Z | - |
| dc.date.available | 2013-03-16T22:43:34Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1999-09-01 | - |
| dc.identifier.citation | Liquid Crystal Materials and Device '99, v., no., pp.199 - 204 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/136820 | - |
| dc.language | ENG | - |
| dc.title | Flip-Chip-on-Glass(FCOG) Technology using Electroless Ni/Cu/Au bump and ACF for LCD Packaging | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 199 | - |
| dc.citation.endingpage | 204 | - |
| dc.citation.publicationname | Liquid Crystal Materials and Device '99 | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
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