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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Analysis of Via Distribution Effect on Multi-layered Power/Ground Transfer Impedance of High-performance Packages

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Kim, Jounghoresearcher / Kim, Hyungsoo / Kim, Jingook / Jeong, Youchul / Park, Jongbae
Publisher
IEEE
Issue Date
2002-10
Language
English
Citation

IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.171 - 174

URI
http://hdl.handle.net/10203/135995
Appears in Collection
EE-Conference Papers(학술회의논문)
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