Analysis of Via Distribution Effect on Multi-layered Power/Ground Transfer Impedance of High-performance Packages
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Kim, Hyungsoo | ko |
| dc.contributor.author | Kim, Jingook | ko |
| dc.contributor.author | Jeong, Youchul | ko |
| dc.contributor.author | Park, Jongbae | ko |
| dc.date.accessioned | 2013-03-16T21:18:49Z | - |
| dc.date.available | 2013-03-16T21:18:49Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2002-10 | - |
| dc.identifier.citation | IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.171 - 174 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/135995 | - |
| dc.language | English | - |
| dc.publisher | IEEE | - |
| dc.title | Analysis of Via Distribution Effect on Multi-layered Power/Ground Transfer Impedance of High-performance Packages | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000179397600037 | - |
| dc.identifier.scopusid | 2-s2.0-15944399633 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 171 | - |
| dc.citation.endingpage | 174 | - |
| dc.citation.publicationname | IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | California | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Kim, Hyungsoo | - |
| dc.contributor.nonIdAuthor | Kim, Jingook | - |
| dc.contributor.nonIdAuthor | Jeong, Youchul | - |
| dc.contributor.nonIdAuthor | Park, Jongbae | - |
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