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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Measurement of Thermomechanical Behaviors of Wafer-Level CSPAssembly under Temperature Cycling Condition

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Ham, Suk-Jin / Lee, Soon-Bokresearcher
Issue Date
2001
Language
ENG
Citation

International Symposium on Electronics Materials and Packagings(EMAP2001), pp.323 - 327

URI
http://hdl.handle.net/10203/132599
Appears in Collection
ME-Conference Papers(학술회의논문)
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