Measurement of Thermomechanical Behaviors of Wafer-Level CSPAssembly under Temperature Cycling Condition
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ham, Suk-Jin | - |
| dc.contributor.author | Lee, Soon-Bok | - |
| dc.date.accessioned | 2013-03-16T15:25:28Z | - |
| dc.date.available | 2013-03-16T15:25:28Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2001 | - |
| dc.identifier.citation | International Symposium on Electronics Materials and Packagings(EMAP2001), v., no., pp.323 - 327 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/132599 | - |
| dc.language | ENG | - |
| dc.title | Measurement of Thermomechanical Behaviors of Wafer-Level CSPAssembly under Temperature Cycling Condition | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 323 | - |
| dc.citation.endingpage | 327 | - |
| dc.citation.publicationname | International Symposium on Electronics Materials and Packagings(EMAP2001) | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
| dc.contributor.nonIdAuthor | Ham, Suk-Jin | - |
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