Browse "Dept. of Mechanical Engineering(기계공학과)" by Type Article

Showing results 9301 to 9320 of 12474

9301
Thermal optimization of vertically oriented, internally finned tubes in natural convection

Joo, Younghwan; Kim, Sung Jin, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.93, pp.991 - 999, 2016-02

9302
Thermal oxidation of tantalum films at various oxidation states from 300 to 700 degrees C

Chandrasekharan, R; Park, Inkyu; Masel, RI; Shannon, MA, JOURNAL OF APPLIED PHYSICS, v.98, no.11, 2005-12

9303
Thermal Packaging of High Temperature Superconductor Bulk for Superconducting Flywheel Energy Storage

Ki, Tae-Kyung; Jeong, Sang-Kwon; Han, Young-Hee; Park, Byung-Jun, IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, v.23, no.3, 2013-06

9304
Thermal pointing error analysis of the observation satellites with interpolated temperature based on PAT method

Lim, Jae Hyuk; Kim, Sun-Won; Kim, Jeong-Hoon; Kim, Chang-Ho; Jun, Hyoung-Yoll; Oh, Hyeon Cheol; Shin, Chang Min; et al, 한국항공우주학회지, v.44, no.1, pp.80 - 87, 2016-01

9305
Thermal post-buckled behaviors of cylindrical composite shells with viscoelastic damping treatments

Shin, Won-Ho; Lee, Seung-Jun; Oh, Il-Kwon; Lee, In, JOURNAL OF SOUND AND VIBRATION, v.323, no.1-2, pp.93 - 111, 2009-06

9306
Thermal post-buckling analysis of shape memory alloy hybrid composite shell panels

Roh, JH; Oh, Il-Kwon; Yang, SM; Han, Jae-Hung; Lee, In, SMART MATERIALS & STRUCTURES, v.13, no.6, pp.1337 - 1344, 2004-12

9307
Thermal post-buckling behavior of patched laminated panels under uniform and non-uniform temperature distributions

Lee, JJ; Oh, Il-Kwon; Lee, In; Yeom, CH, COMPOSITE STRUCTURES, v.55, no.2, pp.137 - 145, 2002-02

9308
Thermal Properties and Phonon Spectral Characterization of Synthetic Boron Phosphide for High Thermal Conductivity Applications

Kang, Joon Sang; Wu, Huan; Hu, Yongjie, NANO LETTERS, v.17, no.12, pp.7507 - 7514, 2017-12

9309
Thermal radiation at the nanoscale and applications

Chapuis, Pierre-Olivier; Lee, Bong Jae; Rodriguez, Alejandro, APPLIED PHYSICS LETTERS, v.123, no.22, 2023-11

9310
Thermal sintering of solution-deposited nanoparticle silver ink films characterized by spectroscopic ellipsometry

Pan, Heng; Ko, Seung Hwan; Grigoropoulos, Costas P., APPLIED PHYSICS LETTERS, v.93, no.23, 2008-12

9311
Thermal snapping and vibration characteristics of cylindrical composite panels using layerwise theory

Oh, Il-Kwon; Lee, In, COMPOSITE STRUCTURES, v.51, no.1, pp.49 - 61, 2001-01

9312
Thermal softening behavior up to fracture initiation during high-rate deformation

Lee, Chang Soo; Yoon, Jeong Whan; Woo, Sang Hyun; Park, Lee Ju, INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, v.251, 2023-08

9313
Thermal stability characteristics of high-power, large-capacity, reserve thermal batteries with pure Li and Li(Si) anodes

Cho, Jang-Hyeon; Im, Chae Nam; Choi, Chi Hun; Ha, Sang-hyeon; Yoon, Hyun-Ki; Choi, Yusong; Bae, Joongmyeon, ELECTROCHIMICA ACTA, v.353, 2020-09

9314
Thermal stabilization for accurate dimensional measurement using gallium

Keem, T; Kim, Seung-Woo, INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, v.44, no.7-8, pp.701 - 706, 2004-06

9315
Thermal stress analysis in structural elements of HRSG casing

Shin, Hyuntae; Kim, Daehee; Ahn, Hyungjun; Choi, Sangmin; Myoung, Gichul, International Journal of Energy Engineering, v.2, no.5, pp.202 - 209, 2012

9316
Thermal stress and fatigue analysis of exhaust manifold

Yoon, S.; Lee, K.O.; Lee, Soon-Bok; Park, K.H., ADVANCES IN FRACTURE AND FAILURE PREVENTION, PTS 1 AND 2 Book Series: KEY ENGINEERING MATERIALS, v.261-263, no.II, pp.1203 - 1208, 2004

9317
Thermal transport in layer-by-layer assembled polycrystalline graphene films

Estrada, David; Li, Zuanyi; Choi, Gyung-Min; Dunham, Simon N.; Serov, Andrey; Lee, Jungchul; Meng, Yifei; et al, Npj 2d Materials and Applications, v.3, 2019-03

9318
THERMAL-ANALYSIS OF SOLIDIFICATION BY THE TEMPERATURE RECOVERY METHOD

TSZENG, TC; Im, Yong-Taek; KOBAYASHI, S, INTERNATIONAL JOURNAL OF MACHINE TOOLS MANUFACTURE, v.29, no.1, pp.107 - 120, 1989-01

9319
Thermal-Conductivity Enhancement by Surface Electromagnetic Waves Propagating along Multilayered Structures with Asymmetric Surrounding Media

Lim, Mikyung; Ordonez-Miranda, Jose; Lee, Seung-Seob; Lee, Bong Jae; Volz, Sebastian, PHYSICAL REVIEW APPLIED, v.12, no.3, 2019-09

9320
Thermally Controlled Localized Porous Graphene for Integrated Graphene-Paper Electronics

Tham, Nicholas Cheng Yang; Sahoo, Pankaj Kumar; Kim, Yeongae; Hegde, Chidanand; Lee, Seok Woo; Kim, Young-Jin; Murukeshan, Vadakke Matham, ADVANCED MATERIALS TECHNOLOGIES, v.6, no.5, 2021-05

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