Browse "Dept. of Mechanical Engineering(기계공학과)" by Author Yang, SY
Showing results 1 to 11 of 11
| A comparative study of the fatigue Behavior of SnAgCu and SnPb solder joints Kim, IH; Park, TS; Yang, SY; Lee, Soon-Bok, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, v.297-300, pp.831 - 836, 2005 |
| A Study of In-Plane Micro-Moire Technique using Phase-Shifting Method Yang, SY; Ham, SJ; Lee, Soon-Bok, KSME 2000 Conference of Materials and Fracture Division, pp.294 - 300, 2000-02 |
| A study on reliability of flip-chip solder joints using Pb-free solders and electroless Ni-P UBMs Lee, Soon-Bok; Paik, KW; Jeon, YD; Yang, SY; Kwon, YM, Pan Pacific Microelectronics symposium, 2005 |
| Analytical Approach to Evaluate Shear Stress in flip Chip Interconnection using NCA/ACF Lee, Soon-Bok; Paik, Kyung-Wook; Kwom, WS; Yang, SY, 5th International Symposium on Electronic Materials and Packagings 2003, pp.204 - 209, 2002 |
| Chip warpage damage model for ACA film type electronic packages Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005 |
| Performance of anode-supported SOFC cells using thin electrolyte of scandia-doped zirconia at intermediate temperatures Yoo, YS; Park, JK; Yang, SY; Oh, JM; Bae, Joongmyeon, 3rd International Conference on Fuel Cell Science, Engineering, and Technology, 2005, pp.305 - 309, 2005-05-23 |
| Performance of single cells and short stacks for intermediate temperature solid oxide fuel cell using thin electrolyte of YSZ and ScSZ Yoo, YS; Park, JK; Yang, SY; Lim, HC; Oh, JM; Bae, Joongmyeon, 207th Meeting of the Electrochemical Society, v.7, pp.403 - 410, 2005-05-15 |
| Realization of high sensitivity displacement field from moire interferometer with rough phase shifting mechanism and pattern matching technique Yang, SY; Lee, Soon-Bok, OPTICS AND LASERS IN ENGINEERING, v.43, no.6, pp.721 - 736, 2005-06 |
| Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages Yang, SY; Jeon, YD; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.46, pp.512 - 522, 2006-02 |
| The effect of Tg on thermo-mechanical deformation and reliability of adhesive flip chip assemblies during temperature cycling Kwon, WS; Yang, SY; Lee, Soon-Bok; Paik, Kyung-Wook, Proceedings - 54th Electronic Components and Technology Conference, pp.1731 - 1737, IEEE, 2004-06-01 |
| The experimental and theoretical approaches of contraction stress build-up of anisotropic conductive adhesives for flip chip interconnection Kwon, WS; Yang, SY; Lee, Soon-Bok; Paik, Kyung-Wook, 55th Electronic Components and Technology Conference, ECTC, pp.1468 - 1474, IEEE, 2005-05-31 |
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