Browse "Dept. of Mechanical Engineering(기계공학과)" by Type Article
Showing results 9261 to 9280 of 12423
| Thermal Properties and Phonon Spectral Characterization of Synthetic Boron Phosphide for High Thermal Conductivity Applications Kang, Joon Sang; Wu, Huan; Hu, Yongjie, NANO LETTERS, v.17, no.12, pp.7507 - 7514, 2017-12 |
| Thermal radiation at the nanoscale and applications Chapuis, Pierre-Olivier; Lee, Bong Jae; Rodriguez, Alejandro, APPLIED PHYSICS LETTERS, v.123, no.22, 2023-11 |
| Thermal sintering of solution-deposited nanoparticle silver ink films characterized by spectroscopic ellipsometry Pan, Heng; Ko, Seung Hwan; Grigoropoulos, Costas P., APPLIED PHYSICS LETTERS, v.93, no.23, 2008-12 |
| Thermal snapping and vibration characteristics of cylindrical composite panels using layerwise theory Oh, Il-Kwon; Lee, In, COMPOSITE STRUCTURES, v.51, no.1, pp.49 - 61, 2001-01 |
| Thermal softening behavior up to fracture initiation during high-rate deformation Lee, Chang Soo; Yoon, Jeong Whan; Woo, Sang Hyun; Park, Lee Ju, INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, v.251, 2023-08 |
| Thermal stability characteristics of high-power, large-capacity, reserve thermal batteries with pure Li and Li(Si) anodes Cho, Jang-Hyeon; Im, Chae Nam; Choi, Chi Hun; Ha, Sang-hyeon; Yoon, Hyun-Ki; Choi, Yusong; Bae, Joongmyeon, ELECTROCHIMICA ACTA, v.353, 2020-09 |
| Thermal stabilization for accurate dimensional measurement using gallium Keem, T; Kim, Seung-Woo, INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, v.44, no.7-8, pp.701 - 706, 2004-06 |
| Thermal stress analysis in structural elements of HRSG casing Shin, Hyuntae; Kim, Daehee; Ahn, Hyungjun; Choi, Sangmin; Myoung, Gichul, International Journal of Energy Engineering, v.2, no.5, pp.202 - 209, 2012 |
| Thermal stress and fatigue analysis of exhaust manifold Yoon, S.; Lee, K.O.; Lee, Soon-Bok; Park, K.H., ADVANCES IN FRACTURE AND FAILURE PREVENTION, PTS 1 AND 2 Book Series: KEY ENGINEERING MATERIALS, v.261-263, no.II, pp.1203 - 1208, 2004 |
Thermal transport in layer-by-layer assembled polycrystalline graphene films Estrada, David; Li, Zuanyi; Choi, Gyung-Min; Dunham, Simon N.; Serov, Andrey; Lee, Jungchul; Meng, Yifei; et al, Npj 2d Materials and Applications, v.3, 2019-03 |
| THERMAL-ANALYSIS OF SOLIDIFICATION BY THE TEMPERATURE RECOVERY METHOD TSZENG, TC; Im, Yong-Taek; KOBAYASHI, S, INTERNATIONAL JOURNAL OF MACHINE TOOLS MANUFACTURE, v.29, no.1, pp.107 - 120, 1989-01 |
| Thermal-Conductivity Enhancement by Surface Electromagnetic Waves Propagating along Multilayered Structures with Asymmetric Surrounding Media Lim, Mikyung; Ordonez-Miranda, Jose; Lee, Seung-Seob; Lee, Bong Jae; Volz, Sebastian, PHYSICAL REVIEW APPLIED, v.12, no.3, 2019-09 |
| Thermally Controlled Localized Porous Graphene for Integrated Graphene-Paper Electronics Tham, Nicholas Cheng Yang; Sahoo, Pankaj Kumar; Kim, Yeongae; Hegde, Chidanand; Lee, Seok Woo; Kim, Young-Jin; Murukeshan, Vadakke Matham, ADVANCED MATERIALS TECHNOLOGIES, v.6, no.5, 2021-05 |
| Thermally enhanced osmotic power generation from salinity difference Han, Jeonghoon; Ko, Young-Su; Nam, Youngsuk; Lee, Choongyeop, JOURNAL OF MEMBRANE SCIENCE, v.672, 2023-04 |
| THERMALLY INDUCED FLOW OSCILLATION IN VERTICAL 2-PHASE NATURAL CIRCULATION LOOP Lee, Sang Yong; ISHII, M, NUCLEAR ENGINEERING AND DESIGN, v.122, no.1-3, pp.119 - 132, 1990-09 |
| Thermally stable and soft pressure-sensitive adhesive for foldable electronics Jo, Woosung; Jeong, Kihoon; Park, Young-Sam; Lee, Jeong-Ik; Im, Sung Gap; Kim, Taek-Soo, CHEMICAL ENGINEERING JOURNAL, v.452, 2023-01 |
| Thermally-forced stratification build-up in an initially isothermal, contained fluid Hyun, Jae Min, JOURNAL OF THE PHYSICAL SOCIETY OF JAPAN, v.54, no.3, pp.942 - 949, 1985-03 |
| Thermally/mechanically robust anodic aluminum oxide (AAO) microheater platform for low power chemoresistive gas sensor Lee, Byeongju; Cho, Incheol; Kang, Mingu; Yang, Daejong; Park, Inkyu, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.33, no.8, 2023-08 |
| Thermo-compressive transfer printing for facile alignment and robust device integration of nanowires Lee, Won Seok; Won, Sejeong; Park, Jeunghee; Lee, Jihye; Park, Inkyu, NANOSCALE, v.4, no.11, pp.3444 - 3449, 2012-03 |
| Thermo-elasto-plastic finite element analysis of quenching process of carbon steel Kang, SH; Im, Yong-Taek, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.192-193, no.SI, pp.381 - 390, 2007-08 |
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