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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

ESPI를 이용한 플립칩 패키지의 열적 전단변형률 평가

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장우순 / 이백우 / 김동원 / 나재웅 / 백경욱researcher / 권동일
Publisher
대한용접학회
Issue Date
2001-10-25
Language
KOR
Citation

대한용접학회 2001년도 추계학술대회, pp.0 - 0

URI
http://hdl.handle.net/10203/126477
Appears in Collection
MS-Conference Papers(학술회의논문)
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