The Study on the Under Bump Metallurgy (UBM) and 63SN-37PB solder bumps interface for flip chip interconnection
- Issue Date
- 1998-04-14
- Language
- English
- Citation
Proceedings of the 1998 MRS Spring Symposium, pp.67 - 72
- ISSN
- 0272-9172
- Appears in Collection
- MS-Conference Papers(학술회의논문)
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