The Study on the Under Bump Metallurgy (UBM) and 63SN-37PB solder bumps interface for flip chip interconnection
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Jang, Se-Young | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2013-03-15T12:44:39Z | - |
| dc.date.available | 2013-03-15T12:44:39Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1998-04-14 | - |
| dc.identifier.citation | Proceedings of the 1998 MRS Spring Symposium, pp.67 - 72 | - |
| dc.identifier.issn | 0272-9172 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/119564 | - |
| dc.language | English | - |
| dc.publisher | Proceedings of the 1998 MRS Spring Symposium | - |
| dc.title | The Study on the Under Bump Metallurgy (UBM) and 63SN-37PB solder bumps interface for flip chip interconnection | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000076552800008 | - |
| dc.identifier.scopusid | 2-s2.0-0031624061 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 67 | - |
| dc.citation.endingpage | 72 | - |
| dc.citation.publicationname | Proceedings of the 1998 MRS Spring Symposium | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | San Francisco, CA, USA | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Jang, Se-Young | - |
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