Bond-Slip 효과를 고려한 유한요소모델

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Publisher
한국전산구조공학회
Issue Date
1991-09
Language
KOR
Citation

한국전산구조공학회 학술발표회, pp.17 - 21

URI
http://hdl.handle.net/10203/105538
Appears in Collection
CE-Conference Papers(학술회의논문)
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