Bond-Slip 효과를 고려한 유한요소모델
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 곽효경 | - |
| dc.contributor.author | 최창근 | - |
| dc.date.accessioned | 2013-03-14T05:05:43Z | - |
| dc.date.available | 2013-03-14T05:05:43Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1991-09 | - |
| dc.identifier.citation | 한국전산구조공학회 학술발표회, v., no., pp.17 - 21 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/105538 | - |
| dc.language | KOR | - |
| dc.publisher | 한국전산구조공학회 | - |
| dc.title | Bond-Slip 효과를 고려한 유한요소모델 | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 17 | - |
| dc.citation.endingpage | 21 | - |
| dc.citation.publicationname | 한국전산구조공학회 학술발표회 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | 곽효경 | - |
| dc.contributor.nonIdAuthor | 최창근 | - |
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- CE-Conference Papers(학술회의논문)
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