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Showing results 87161 to 87180 of 99935
| W0.5TaTiVCr-based composite reinforced with W-mesh for fusion plasma-facing applications Waseem, Owais Ahmed; Ryu, Ho Jin, FUNCTIONAL COMPOSITES AND STRUCTURES, v.2, no.1, pp.015004, 2020-03 |
| Wafer delay analysis and control of dual-armed cluster tools with chamber cleaning operations Yu, Tae-Sun; Lee, Tae-Eog, INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH, v.58, no.2, pp.434 - 447, 2020-01 |
| Wafer Delay Analysis and Workload Balancing of Parallel Chambers for Dual-Armed Cluster Tools With Multiple Wafer Types Ko, Sung-Gil; Yu, Tae-Sun; Lee, Tae-Eog, IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, v.18, no.3, pp.1516 - 1526, 2021-07 |
| Wafer distribution system for a clean room using a novel magnetic suspension technique Park, KH; Ahn, KY; Kim, Soohyun; Kwak, Yoon Keun, IEEE-ASME TRANSACTIONS ON MECHATRONICS, v.3, no.1, pp.73 - 78, 1998-03 |
| Wafer Surface Scanner를 이용한 반도체 웨이퍼상의 입자 침착속도의 측정 배귀남; 박승오; 이춘식; 명현국; 신흥태, 설비공학논문집, v.5, no.2, pp.130 - 140, 1993-05 |
| Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly Lee, Seyong; Lee, HanMin; Shin, Ji Won; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1258 - 1264, 2017-08 |
| Wafer-level flip chip packages using preapplied anisotropic conductive films (ACFs) Son, HY; Chung, CK; Yim, MJ; Hwang, JS; Paik, Kyung-Wook; Jung, GJ; Lee, JK, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, no.3, pp.221 - 227, 2007-07 |
| Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections Kim, Il; Jang, Kyung-Woon; Son, Ho-Young; Kim, Jae-Han; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.5, pp.792 - 797, 2011-05 |
| Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn-Ag Microbump Interconnection Lee, Hyeong Gi; Choi, Yong-Won; Shin, Ji Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.11, pp.1567 - 1572, 2015-11 |
| Wafer-scale controlled Au/Pt bimetallic flowerlike structure array Huang, Xing-Jiu; Kim, Ju-Hyun; Choi, Yang-Kyu, GOLD BULLETIN, v.41, no.1, pp.58 - 65, 2008-04 |
| Wafer-scale crack-free AlGaN on GaN through two-step selective-area growth for optically pumped stimulated emission Ko, Young-Ho; Bae, Sung-Bum; Kim, Sung-Bock; Kim, Dong Churl; Leem, Young Ahn; Cho, Yong-Hoon; Nam, Eun-Soo, JOURNAL OF CRYSTAL GROWTH, v.445, pp.78 - 83, 2016-07 |
| Wafer-Scale Fabrication and Characterization of Thin-Film Transistors with Polythiophene-Sorted Semiconducting Carbon Nanotube Networks Liyanage, Luckshitha Suriyasena; Lee, Hangwoo; Patil, Nishant; Park, Steve; Mitra, Subhasish; Bao, Zhenan; Wong, Hon Sum Philip, ACS NANO, v.6, no.1, pp.451 - 458, 2012-01 |
| Wafer-Scale Multilayer Fabrication for Silk Fibroin-Based Microelectronics Kook, Geon; Jeong, Sohyeon; Kim, So Hyun; Kim, MiKyung; Lee, Sungwoo; Cho, Il-Joo; Choi, Nakwon; et al, ACS APPLIED MATERIALS & INTERFACES, v.11, no.1, pp.115 - 124, 2019-01 |
| Wafer-scale synthesis of monolayer two-dimensional porphyrin polymers for hybrid superlattices Zhong, Yu; Cheng, Baorui; Park, Chibeom; Ray, Ariana; Brown, Sarah; Mujid, Fauzia; Lee, Jae-Ung; et al, SCIENCE, v.366, no.6471, pp.1379 - 1384, 2019-12 |
| Wafer-Scale Ultrathin, Single-Crystal Si and GaAs Photocathodes for Photoelectrochemical Hydrogen Production Lee, Yong Hwan; Kim, Jaehoon; Oh, Jihun, ACS APPLIED MATERIALS & INTERFACES, v.10, no.39, pp.33230 - 33237, 2018-10 |
| Wafer-Scale Unidirectional Alignment of Supramolecular Columns on Faceted Surfaces Jin, Hyeong Min; Park, Kangho; Kwon, Kiok; Yang, Geon Gug; Han, Young-Soo; Kim, Hwa Soo; Kim, Sang Ouk; et al, ACS NANO, v.15, no.7, pp.11762 - 11769, 2021-07 |
| Wafer-Scale Uniform Growth of an Atomically Thin MoS2 Film with Controlled Layer Numbers by Metal-Organic Chemical Vapor Deposition Hong, Woonggi; Park, Cheolmin; Shim, Gi Woong; Yang, Sang Yoon; Choi, Sung-Yool, ACS APPLIED MATERIALS & INTERFACES, v.13, no.42, pp.50497 - 50504, 2021-10 |
| Wafer-scale, highly uniform, and well-arrayed suspended nanostructures for enhancing the performance of electronic devices Zhao, Zhi-Jun; Ahn, Junseong; Lee, Dongheon; Jeong, Chan Bae; Kang, Mingu; Choi, Jungrak; Bok, Moonjeong; et al, NANOSCALE, v.14, no.4, pp.1136 - 1143, 2022-01 |
| Wageningen B-Series 프로펠러의 최적 선택방법 한순흥, 한국기계연구원 연구논문집 , v.2, no.1, pp.1 - 6, 1979-11 |
Waiting for affordable housing in New York City Sieg, Holger; Yoon, Chamna, QUANTITATIVE ECONOMICS, v.11, no.1, pp.277 - 313, 2020-01 |
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