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Showing results 103281 to 103300 of 279471
| High-frequency hydrogen combustion dynamics driven by local flame displacement and multidimensional thermoacoustic interactions Park, Dohyung; Park, Jaehyun; Kim, Kyu Tae, COMBUSTION AND FLAME, v.267, 2024-09 |
| High-Frequency Ignition Characteristics in a 4-Valve SI Engine with Tumble-Swirl Flows Bae, Choong-Sik; Lee, JS; Ha, JY, SAE Technical Paper 981433, no.1370, pp.1 - 8, 1998-05 |
| High-Frequency Ignition Characteristics in a 4-Valve SI Engine with Tumble-Swirl Flows Bae, Choongsik; Lee, J.S.; Ha, J.Y., Society of Automotive Engineers, pp.0 - 0, 1998-05 |
| High-frequency Measurements of TSV failures Kim, Joohee; Cho, Jonghyun; Pak, Jun So; Kim, Joungho; Yook, Jong-Min; Kim, Jun Chul, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
| High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package Kim, Hyesoo; Kim, Jonghoon J.; Park, Junyong; Park, Shinyoung; Choi, Sumin; Bae, Bumhee; Ha, DongHo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1356 - 1368, 2017-08 |
| High-frequency modeling and signal integrity analysis of high-density silicone rubber socket Kim, Hyesoo; Park, Junyong; Park, Shinyoung; Kim, Jonghoon J; Kim, Joungho; Ha, Dongho; Bae, Michael; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, pp.55 - 57, Institute of Electrical and Electronics Engineers Inc., 2016-12 |
| High-frequency on-chip inductance model Sim, SP; Lee, Kwyro; Yang, CY, IEEE ELECTRON DEVICE LETTERS, v.23, no.12, pp.740 - 742, 2002-12 |
| High-Frequency Performance of GaAs Floated Electron Channer FET(FECFET) Kwon, Young Se, International Conference on VLSI and CAD, 1993 |
| HIGH-FREQUENCY RESONANT AC/DC RECTIFIER WITH UNITY POWER-FACTOR CHOI, HC; HAN, JW; Youn, Myung Joong, ELECTRONICS LETTERS, v.28, no.17, pp.1592 - 1594, 1992-08 |
| High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV) Kim, Joo-Hee; Pak, Jun-So; Cho, Jong-Hyun; Song, Eak-Hwan; Cho, Jeong-Hyeon; Kim, Hee-Gon; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.181 - 195, 2011-02 |
| High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via Kim, Joo-Hee; Cho, Jong-Hyun; Kim, Joungho; Yook, Jong-Min; Kim, Jun Chul; Lee, Junho; Park, Kunwoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.4, pp.697 - 707, 2014-04 |
| High-frequency scalable modeling of a through silicon via (TSV) and proposal of a failure detection method of 3D ICs = 3차원 집적회로에서 TSV의 고주파 모델링 및 TSV 불량 검출 방법에 관한 연구link Kim, Joo-Hee; 김주희; et al, 한국과학기술원, 2013 |
| High-frequency seismic response during permeability reduction due to biopolymer clogging in unconsolidated porous media Kwon, Tae-Hyuk; Ajo-Franklin, Jonathan B., GEOPHYSICS, v.78, no.6, pp.117 - 127, 2013-11 |
| High-frequency seismic responses and permeability reduction caused by bacterial activities in soils = 박테리아 활동에 의한 흙의 탄성파 전파특성 및 투수성 감소link Noh, Dong-Hwa; Kwon, Tae-Hyuk; et al, 한국과학기술원, 2015 |
| HIGH-FREQUENCY SIGNAL PREDISTORTION DEVICE AND NONLINEAR DISTORTION CORRECTING DEVICE FOR POWER AMPLIFIER 이용훈; 이상일; 김민현; 설영욱; 정의림; 홍순일; 김성진; et al, 2018-03-20 |
| High-frequency silicone rubber socket modeling and reliability investigations = 실리콘 고무 소켓의 고주파 모델링과 신뢰성 분석link Kim, Hyesoo; 김혜수; et al, 한국과학기술원, 2016 |
| High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoung; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wook; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09 |
| High-frequency switching class-D power amplifier for portable sound applications Choi, B.K.; Hong, Y.U.; Kwak, T.W.; Lee, M.C.; Cho, Gyu-Hyeong, 37th IEEE Power Electronics Specialists Conference 2006, PESC'06, pp.1 - 4, IEEE, 2006-06-18 |
| High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs Lee, Man Ho; Jung, Daniel Hyunsuk; Kim, Hee-Gon; Cho, Jong-Hyun; Kim, Joungho, IEEE DESIGN & TEST OF COMPUTERS, v.33, no.2, pp.17 - 29, 2016-03 |
| High-frequency transverse combustion instabilities of lean-premixed multislit hydrogen-air flames Lee, Taesong; Kim, Kyu Tae, COMBUSTION AND FLAME, v.238, no.4, 2022-04 |
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