High-frequency silicone rubber socket modeling and reliability investigations실리콘 고무 소켓의 고주파 모델링과 신뢰성 분석

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 995
  • Download : 0
Recently, the data rate per pin for high bandwidth digital application has been continuously increasing, as indicated by multiple I/O standards. For instance, as bandwidth of LPDDR is expanded up to 25.6 GB/s, the per-pin data-rate of LPDDR4 exceed 3.2 Gbps, which is twice that of LPDDR3. Considering this technical trend, to obtain reliable package test result, test socket, which electrically interconnects the package device to the load board, should cover the targeted data rate of the package device. The pogo pin socket has been generally used for the package test despite a few drawbacks. Firstly, one of the mechanical problems is the chance of damaging the device or the socket itself. Because in order to achieve low contact resistance, substantial pressing force or sharper contact tip is needed to penetrate the oxide layer or contaminants, which are formed by routine test. As a result, this process causes not only the witness marks on the surface of the solder ball of package device, but even the fatigue in the contact tip which could decrease the yield as well. Secondly, due to the long length of pin, it cannot guarantee signal in-tegrity at higher frequency. Because the components of pogo pin such as barrel or spring require fine preci-sion, manufacturing of it is both difficult and costly. Therefore, to overcome these problem, a new type sock-et design is required. In this research, we propose the structure and model of silicone rubber socket and verify it through 3D field simulation and measurement. Silicone rubber socket consists of rubber columns at a fixed pitch, which are formed with a number of gold-coated nickel powders in silicone rubber substrate. Signal from the device is transferred to the load board through vertically-aligned metal powders. Through comparison and discussion with pogo type socket, it exhibits excellent RF performance. Reliability of the socket is analyzed in frequency domain
Advisors
Kim, Jounghoresearcher김정호researcher
Description
한국과학기술원 :전기및전자공학부,
Publisher
한국과학기술원
Issue Date
2016
Identifier
325007
Language
eng
Description

학위논문(석사) - 한국과학기술원 : 전기및전자공학부, 2016.2 ,[vi, 37 p. :]

Keywords

Silicone Rubber Socket; High-frequency Package Test; Test socket; Socket Modeling; Reliability Test; 실리콘 고무 소켓; 고주파 패키지 테스트; 테스트 소켓; 소켓 모델링; 신뢰성 검사

URI
http://hdl.handle.net/10203/221686
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=649598&flag=dissertation
Appears in Collection
EE-Theses_Master(석사논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0