Showing results 214941 to 214960 of 279409
W-Ni-Fe 중합금의 액상소결중 소결분위기의 변화가 기공소멸에 미치는 영향 = Effect of atmosphere change on the liquid-filling of pores during liquid phase sintering of W-Ni-Felink 홍병선; Hong, Byung-Sun; 윤덕용; 강석중; et al, 한국과학기술원, 1985 |
W-Ni-Fe중합금에서 칼슘이나 란타늄 첨가에 따른 황과 인에 의한 취화의 제거 홍성현; 강석중; 윤덕용, 대한금속·재료학회지, v.29, no.9, pp.925 - 932, 1991-01 |
W-대역 수동 이미징을 위한 디케 복사계 (Dicke Radiometer) 설계 = Design of W-band dicke radiometer for passive imaginglink 송원영; 홍성철; et al, 한국과학기술원, 2020 |
W-밴드데역에서의 칩투칩통신을 위한 고이득 및 광대역 비발디 안테나 JANG, TAEHWAN; Kim, Hong-Yi; Oh, Inn-Yeal; Park, Chul Soon, 2014년 한국ITS학회 추계학술대회, 한국ITS학회, 2014-10-31 |
W/CoFeB/MgO 구조에서 스핀-오빗 토크와 스핀 홀 자기저항의 상관관계 백승헌; 조순하; 조영훈; 박병국, 2015 동계학술대회, 한국 자기학회, 2015-11-27 |
W0.5TaTiVCr-based composite reinforced with W-mesh for fusion plasma-facing applications Waseem, Owais Ahmed; Ryu, Ho Jin, FUNCTIONAL COMPOSITES AND STRUCTURES, v.2, no.1, pp.015004, 2020-03 |
W2F2Q : 무선 패킷 네트워크에서 공평 큐잉 이융; 석용호; 최양희; 한동원, 한국통신학회 하계학술대회, 2000 |
W2F2Q: Packet Fair Queuing inWireless Packet Networks Yi, Yung; Seok, Yongho; Kwon, Taekyoung; Choi, Yanghee; Park, Junseok, The 3rd ACM International Workshop on Wireless Mobile Multimedia, WoWMoM 2000, pp.2 - 10, ACM, 2000-08-11 |
WADN : 웹 어플리케이션 전송 기법을 이용한 어플리케이션 서버의 동적 확장 방법 = WADN : a method for extending application servers dynamically using a Web application delivery mechanismlink 임민열; Lim, Min-Yeol; et al, 한국과학기술원, 2002 |
WADN: Web Application Delivery Network Kim, Jungsook; Jo, SungJae; Song, Junehwa; Lim, Minyeol; Park, Hyungwoo, International Conference on Ubiquitous Computing(ICUC), pp.0 - 0, ICUC, 2003-10-01 |
Wafer admission control for clustered photolithography tools Park, Kyung Soo; Morrison J.R., 2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2010, pp.220 - 225, 2010-07-11 |
Wafer admission control for clustered photolithography tools Park, Kyungsu; Morrison, James R, Advanced Semiconductor Manufacturing Conference , pp.220 - 225, ASMC, 2010-07 |
Wafer Coating Process of Cu-based Methanol Steam Reforming Catalysts for Wafer Based MEMS Catalytic Reactor Kim, Taegyu; Lee, Dae Hoon; Yoon, Chun Ho; Kwon, Sejin, The 6th International Symposium on Nanocomposites & Nanoporous Materials, 2005-02 |
Wafer delay analysis and control of dual-armed cluster tools with chamber cleaning operations Yu, Tae-Sun; Lee, Tae-Eog, INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH, v.58, no.2, pp.434 - 447, 2020-01 |
Wafer Delay Analysis and Workload Balancing of Parallel Chambers for Dual-Armed Cluster Tools With Multiple Wafer Types Ko, Sung-Gil; Yu, Tae-Sun; Lee, Tae-Eog, IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, v.18, no.3, pp.1516 - 1526, 2021-07 |
Wafer distribution system for a clean room using a novel magnetic suspension technique Park, KH; Ahn, KY; Kim, Soohyun; Kwak, Yoon Keun, IEEE-ASME TRANSACTIONS ON MECHATRONICS, v.3, no.1, pp.73 - 78, 1998-03 |
Wafer exfoliation 기술을 이용한 플렉서블 이차전지 제작 및 방법 이건재; 박귀일; 황건태; 정창규, 2014-06-30 |
Wafer fabrication scheduling subject to resource constraints = 자원제약을 고려한 웨이퍼 제조 스케쥴링link Joo, Byung-Jun; 주병준; et al, 한국과학기술원, 2007 |
Wafer flow time control of track systems for semiconductor manufacturinglink Lee, Minho; Lee, Tae-Eog; et al, 2021 |
Wafer level ACA packages and their applications to advanced electronic packaging Paik, Kyung-Wook; Son, HY; Kim, I; Chung, CK, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456, 123, 2008-12-09 |
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