| 1 | (A) study on the interfacial reaction between lead-free solders and electroplated Ni or Cu metallization and its effect on mechanical reliability = 무연솔더와 전기도금된 니켈 및 구리와의 계면반응과 기계적 신뢰성에 미치는 영향에 관한 연구link Kim, Jong-Yeon; 김종연; et al, 한국과학기술원, 2008 |
| 2 | Characterization of closed-loop solder-line bonding for hermetic MEMS packaging = 사각고리형 금속 박막을 이용한 마이크로시스템의 밀봉 패키징 및 누설 특성 시험link Kim, Seong-A; 김성아; et al, 한국과학기술원, 2002 |
| 3 | Creep deformation of lead-free Sn-3.5Ag-Bi solders Shin, SW; Yu, Jin, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.42, no.3, pp.1368 - 1374, 2003-03 |
| 4 | Cu 또는 Bi 첨가가 Sn-3.5Ag계 무연 솔더 합금의 크리프 특성에 미치는 영향 = Effects of Cu or Bi addition to the creep properties of Sn-3.5Ag based lead-free solder alloyslink 신승우; Shin, Seung-Woo; et al, 한국과학기술원, 2003 |
| 5 | Effects of Solder Ball Geometry on Lap Shear Creep Rate Kim, Sung-Bum; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.3, pp.326 - 332, 2010-03 |
| 6 | Fatigue and fracture assessment for reliability in electronics packaging Lee, Soon-Bok; Kim, I; Park, TS, INTERNATIONAL JOURNAL OF FRACTURE, v.150, pp.91 - 104, 2008-03 |
| 7 | Growth kinetics of Cu-Sn intermetallic compounds at interface of 80Sn-20Pb electrodeposits and Cu based leadframe alloy, and its influence on the fracture resistance to 90 degrees-bending Suh, MS; Kwon, Hyuk-Sang, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.39, no.10, pp.6067 - 6073, 2000-10 |
| 8 | High Power and High Reliability Flex-On-Board Assembly Using Solder Anisotropic Conductive Films Combined with Ultrasonic Bonding Technique Lee, Ki-Won; Saarinen, Ilkka J.; Pykari, Lasse; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.12, pp.1901 - 1907, 2011-12 |
| 9 | Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications Chu, K.-M.; Choi, J.-H.; Lee, J.-S.; Cho, H.S.; Park, SeongOok; Park, HyoHoon; Jeon, D.Y., IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.409 - 414, 2006-08 |
| 10 | Oxidation study of pure tin and its alloys via electrochemical reduction analysis Cho, S; Yu, Jin; Kang, SK; Shih, DY, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.5, pp.635 - 642, 2005-05 |
| 11 | Sn-Ag-Cu계 솔더 합금과 Cu, Ni 기판의 계면 현상 및 계면 생성물의 성장 거동에 관한 연구 = Studies on interfacial reaction and microstructural evolution of joint interface between Sn-Ag-Cu solder alloy and Cu, Ni substratelink 김종훈; Kim, Jong-Hoon; et al, 한국과학기술원, 2005 |
| 12 | Studies on the effects of material design parameters on the board level reliabilities of wafer level chip size package (WLCSP) = 웨이퍼레벨 패키지(WLCSP)의 접합 후 신뢰성에 미치는 재료 설계 인자의 영향에 관한 연구link Kwon, Yong-Min; 권용민; et al, 한국과학기술원, 2011 |
| 13 | Study on Fine Pitch Flex-on-Flex Assembly Using Nanofiber/Solder Anisotropic Conductive Film and Ultrasonic Bonding Method Lee, Sang-Hoon; Suk, Kyoung-Lim; Lee, Ki-Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.12, pp.2108 - 2114, 2012-12 |
| 14 | (The) influence of reflow profile on the thermal fatigue behaviors of BGA solder joint = 리플로 프로파일이 BGA 소더 조인트의 열적 피로 특성에 미치는 영향link Ryu, Jong-Eun; 류종은; et al, 한국과학기술원, 2006 |
| 15 | Ultrasonic Bonding of Anisotropic Conductive Films Containing Ultrafine Solder Balls for High-Power and High-Reliability Flex-On-Board Assembly Kim, Won-Chul; Lee, Ki-Won; Saarinen, Ilkka J.; Pykari, Lasse; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.5, pp.884 - 889, 2012-05 |
| 16 | Ultrasonic-Assisted Thermocompression Bonding Method of Solder Anisotropic Conductive Film Joints for Reliable Camera Module Packaging Kim, Yoo-Sun; Kim, Seung-Ho; Lee, Kiwon; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.12, pp.2156 - 2163, 2013-12 |
| 17 | 다양한 하중 조건에서 솔더 조인트의 신뢰성 평가 기술 및 수명 예측 모델 개발 = Development of the Evaluation Techniques and Life Prediction Model for Solder Joints under Various Loading Conditionslink 김일호; Kim, Il-ho; et al, 한국과학기술원, 2008 |
| 18 | 무연 소더에서의 재료 거동 및 열피로 특성에 대한 미세 구조 영향 = Effects of microstructure on material behaviors and fatigue properties of lead-free solder materialslink 황태경; Hwang, Tae-Kyung; et al, 한국과학기술원, 2007 |
| 19 | 미세조직이 무연 솔더의 크리프 성질에 미치는 영향 = The effect of microstructure on the creep behavior of the lead-free solderslink 주대권; Joo, Dae-Kwon; et al, 한국과학기술원, 2002 |
| 20 | 복합솔더 제조 및 리플로우 솔더링 특성 = The manufacture of composite solder and its reflow soldering characteristicslink 황성용; Hwang, Seong-Yong; et al, 한국과학기술원, 2002 |
| 21 | 전자부품 실장용 Sn-Ag-X 계 솔더 합금의 계면 현상과 특성 평가 = Interfacial phenomena and characterization of Sn-Ag-based solder alloy systems for electronic packaginglink 최원경; Choi, Won-Kyoung; et al, 한국과학기술원, 2001 |
| 22 | 주석-아연 무연 솔더 층을 이용한 실리콘 웨이퍼 접합에 관한 연구 = A study on the silicon wafer bonding using Sn-Zn Pb-free solder layerlink 정용; Jung, Yong; et al, 한국과학기술원, 2008 |
