Cu 또는 Bi 첨가가 Sn-3.5Ag계 무연 솔더 합금의 크리프 특성에 미치는 영향 = Effects of Cu or Bi addition to the creep properties of Sn-3.5Ag based lead-free solder alloys

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Advisors
유진researcherYu, Jinresearcher
Description
한국과학기술원 : 재료공학과,
Publisher
한국과학기술원
Issue Date
2003
Identifier
231100/325007  / 000985196
Language
kor
Description

학위논문(박사) - 한국과학기술원 : 재료공학과, 2003.8, [ viii, 116 p. ]

Keywords

creep; Sn; solder; lead-free; lapshear; 랩시어; 크리프; 주석; 솔더; 무연

URI
http://hdl.handle.net/10203/50450
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=231100&flag=dissertation
Appears in Collection
MS-Theses_Ph.D.(박사논문)
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